Kim, J.-H., & Yoon, Y.-J. (2025). Solid-State On-Chip Thermal Management Using Micro-Thermoelectric Devices. 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC),
S. Kim, E. Kim, W. Lee, M. Sim, I. Kim, J. Noh, J.-H. Kim, S. Lee, I. Park, PC. Su, A. Andreu, Y. -J. Yoon, (2024), Real-time in-process control methods of process parameters for …
A. Andreu, S. Kim, I. Kim, J.-H. Kim, J. Noh, S. Lee, W. Lee, PC Su, Y. -J. Yoon, (2024), Processing Challenges and Delamination Prevention Methods in Titanium-Steel DED 3D …
T. Lee, J.-H. Kim, C.S. Ng, A. Andreu, I. Kim, W. Lee, H. Kim, P.-C. Su, Y.-J. Yoon, (2024), Prediction of curing depth dependence on CNT nanofiller dispersion for vat …
J. Pyeon, S.M. Park, J. Kim, J.-H. Kim, Y.-J. Yoon, D.K. Yoon, H. Kim, (2023), Plasmonic metasurfaces of cellulose nanocrystal matrices with quadrants of aligned gold nanorods for …
Kim, S., Andreu, A., Kim, I., Kim, J.-H., Lee, J., Yoon, Y.-J., (2022), “Continuously Varied Infill Pattern (ConVIP): Improvement of mechanical properties and printing speed of …
Kim, J.-H., Yoon, Y.-J., 2021, Glass transition temperature prediction based on tBA-co-DEGDA composition and 4D printing process full-factorial DOE and machine learning, Korean …
Kim, J.-H., Yoon, Y.-J., 2020, Prediction of 4D Printing shape memory polymer characterization using machine learning, Society for Computational Design and Engineering 2020 fall …